Partition-driven standard cell thermal placement

Author:

Chen Guoqiang,Sapatnekar Sachin

Publisher

ACM Press

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A fast thermal-aware fixed-outline floorplanning methodology based on analytical models;Proceedings of the International Conference on Computer-Aided Design;2018-11-05

2. Three-Dimensional Thermal Modeling: Tools and Methodologies;Lecture Notes in Electrical Engineering;2015

3. 3D thermal-aware floorplanner using a MOEA approximation;Integration;2013-01

4. 3D thermal-aware floorplanner using a MILP approximation;Microprocessors and Microsystems;2012-07

5. Power Profiling-Guided Floorplanner for Thermal Optimization in 3D Multiprocessor Architectures;Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation;2011

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