1. J. Vlach, K. Singhal, in Computer Methods for Circuit Analysis and Design (Springer, 1983)
2. M.B. Kleiner, S.A. Kahn, P. Ramn, W. Weber, Thermal analysis of vertically integrated circuits, in Proceedings of the IEEE International Electron Devices Meeting, pp. 487–490 (1995)
3. T.A. Davis, I.S. Duff, An unsymmetric pattern multifunctional method for sparse LU factorization. SIAM J Matrix Anal. Appl. 18(1), 140–158 (1997)
4. K.D. Hagen, Heat Transfer with Applications. (Prentice-Hall Inc, Upper Saddle River, 1999)
5. T.-Y. Chiang, S.J. Souri, C.O. Chui, K.C. Saraswat, Thermal analysis of heterogeneous 3D-ICs with various integration scenarios, in Proceedings of the IEEE International Electron Devices Meeting, pp. 681–684, Dec (2001)