Microstructural development and mechanical properties of hypereutectic Sn–Cu solderalloys
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference24 articles.
1. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn–Zn and Sn–Pb solders
2. Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder
3. Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
4. Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu
5. The Performance of Lead-Free Solders During a Long-Distance Electric Vehicle Race
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1. Effects of trace addition of Fe on the thermal, microstructure, and tensile creep properties of Sn-0.7Cu eutectic alloy;Journal of Materials Science: Materials in Electronics;2024-04
2. Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification;Materials Today Communications;2024-03
3. Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM;Acta Materialia;2024-01
4. Nucleation and Growth of Cu6sn5 During the Aging Process of Cu/Sn Interface in Electronic Packaging——By In-Situ Tem;2023
5. Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings;Materials & Design;2022-12
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