Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference43 articles.
1. Two-phase η′ + η region in Cu6Sn5 intermetallic: insight into the order–disorder transition from diffusion couples;Wieser;J. Electron. Mater.,2019
2. Cu6Sn5 intermetallic: reconciling composition and crystal structure;Leineweber;Scr. Mater.,2020
3. Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing;Zhang;Acta Mater.,2020
4. Revisiting the phase transformations involving Cu6Sn5 intermetallic: resolving local domain structures induced by ordering;Martin;IOP Conf. Ser.: Mater. Sci. Eng.,2022
5. Domain structure of pseudosymmetric η″-ordered Cu6Sn5 by EBSD analysis;Martin;Acta Mater.,2022
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints;Materials Characterization;2024-09
2. Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations;Materials Characterization;2024-09
3. Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED;Journal of Welding and Joining;2024-08-31
4. Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications;Rare Metals;2024-07-31
5. Reactive diffusion at the interface between Cu and Sn–Ag alloys;Journal of Materials Research and Technology;2024-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3