The Performance of Lead-Free Solders During a Long-Distance Electric Vehicle Race-Reference-Cited by-同舟云学术

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The Performance of Lead-Free Solders During a Long-Distance Electric Vehicle Race

Published:2010 Issue:1 Volume:3 Page:104-109
ISSN:1884-8028
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Nogita Kazuhiro,Greaves Mathew C.,Guymer Benjamin D.,Walsh Bernard B.,Kennedy James M.,Duke Michael D.,Nishimura Tetsuro

Publisher

Japan Institute of Electronics Packaging

Link

http://www.jstage.jst.go.jp/article/jiepeng/3/1/3_1_104/_pdf

Reference10 articles.

1. Electronics Without Lead

2. [2] J. Hwang, Implementing lead-free Electronics. 2004: McGraw-Hill. 473.

3. [3] K. Suganuma, S.-J. Kim, and K.-S. Kim: "High-temperature lead-free solders: Properties and possibilities," JOM, Vol. 61, pp. 64-71, 2009.

4. [4] K. Nogita, C. M. Gourlay, and T. Nishimura, "Cracking and phase stability in reaction layers between Sn–Cu–Ni solders and Cu substrates," JOM, Vol. 61, pp. 45-51, 2009.

5. [5] K. Nogita, et al., "Inhibiting cracking of interfacial Cu₆Sn₅ by Ni additions to Sn-based lead-free solders," Transactions of The Japan Institute of Electronics Packaging (Trans JIEP), Vol. 2, pp. 46-54, 2009.

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