Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference39 articles.
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3. Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition;Wang;Scr. Mater.,2005
4. The Cu-Sn phase diagram, Part I: New experimental results;Fürtauer;Intermetallics,2013
5. The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints;Zeng;Acta Mater.,2015
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1. Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy;Journal of Materials Engineering and Performance;2024-09-09
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