Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s11665-024-09848-y.pdf
Reference36 articles.
1. X.Q. Shi, Z.P. Wang, Q.J. Yang, and H.L.J. Pang, Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy, J. Eng. Mater. Technol., 2003, 125(1), p 81–88.
2. O.R. Adetunji, R.A. Ashimolowo, P.O. Aiyedun, O.M. Adesusi, H.O. Adeyemi, and O.R. Oloyede, Tensile, Hardness and Microstructural Properties of Sn-Pb Solder Alloys, Mater. Today Proc., 2021, 44, p 321–325.
3. X.Y. Bi, X.W. Hu, and Q.L. Li, Effect of Co Addition Into Ni Film on Shear Strength of Solder/Ni/Cu System: Experimental and Theoretical investigation, Mater. Sci. Eng. A, 2020, 788, p 139589.
4. X.H. Wang, Z.H. Yu, Y.W. Yan, W. Gao, X.L. Liu, and W. Du, Effect of Ni on the Microstructure and Properties of Sn-6.5Zn-3.0Bi Solders, Philos. Mag., 2022, 102(24), p 2539–2553.
5. Z.H. Yu, W. Du, J.F. Qiang, X. Yang, and Z. Yang, Intermetallic Compound Evolution and Mechanical Properties of Sn-0.7Cu-0.1Ni-xZn Lead-Free Solder Alloys Prepared by Directional Solidification, Mater. Today Commun., 2024, 38, p 107754.
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