Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Published:2020-08 Issue: Volume:166 Page:110445
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Paixão Jeverton Laureano,Gomes Leonardo Fernandes,Reyes Rodrigo Valenzuela,Garcia Amauri,Spinelli José Eduardo,Silva Bismarck Luiz

Funder

FAPESP

CAPES

CNPq

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. N. K. Kesarkar, T.M.; Sardana, “How TIM impacts thermal performance of eletronics: A thermal point of view study to understand impact of Thermal Interface Materials (TIM),” in International Conference on Electronics Packaging -ICEP, 2019, pp. 200–206.

2. Reliability of thermal interface materials: a review;Due;Appl. Therm. Eng.,2013

3. R. Zhang et al., “Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications,” J. Electron. Packag., vol. 136, no. 1, Mar. 2014, doi: https://doi.org/10.1115/1.4026616.

4. Measurement of solder/copper interfacial thermal resistance by the flash technique;Bai;Int. J. Thermophys.,2005

5. K. Stinson-Bagby, D. Huff, D. Katsis, D. Van Wyk, and G. Q. Lu, “Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages,” in IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004, pp. 27–32, doi: https://doi.org/10.1109/ISEE.2004.1299683.

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys;Materials;2024-09-04

2. Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping;Soldering & Surface Mount Technology;2024-07-31

3. Effects of Different Zinc Content on Solidification, Microstructure, and Mechanical Properties in Tin–Bismuth Alloy;Advanced Engineering Materials;2024-07-30

4. Effect of minor Sb addition on microstructure, interfacial behavior, and mechanical properties of Sn–15Bi solder joints;Journal of Materials Science: Materials in Electronics;2024-06

5. Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder;Materials;2024-05-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3