Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Author:

Zhang Rui1,Cai Jian2,Wang Qian3,Li Jingwei3,Hu Yang3,Du Hongda4,Li Liangliang5

Affiliation:

1. State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China

2. Institute of Microelectronics, Tsinghua University, Tsinghua National Laboratory for Information Science and Technology, Beijing 100084, China

3. Institute of Microelectronics, Tsinghua University, Beijing 100084, China

4. City Key Laboratory of Thermal Management Engineering and Materials, Graduate School at Shenzhen, Tsinghua University, Shenzhen City, Guangdong Province 518055, China

5. State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China e-mail:

Abstract

To promote heat dissipation in power electronics, we investigated the thermal conduction performance of Sn-Bi solder paste between two Cu plates. We measured the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating that it can be a promising candidate for the TIM used for power electronics applications. In addition, we estimated the contact thermal resistance at the interface between the Sn-Bi solder and the Cu plate with the assistance of scanning acoustic microscopy. The experimental data showed that Sn-Bi solder paste could be a promising adhesive material used to attach power modules especially with a large size on the heat sink.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference40 articles.

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