Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique
Author:
Publisher
Springer Science and Business Media LLC
Subject
Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s10765-005-8107-4.pdf
Reference9 articles.
1. Thermal boundary resistance
2. Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
3. H. J. Lee, Thermal Diffusivity in Layered and Dispersed Composites (Ph. D. dissertation, Purdue University, 1975).
4. Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging
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