Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference132 articles.
1. Y.J. Dai, J.J. Gou, X.J. Ren, F. Bai, W.Z. Fang, W.Q. Tao, A test-validated prediction model of thermal contact resistance for Ti-6Al-4V alloy. Appl. Energy 228(2017), 1601–1617 (2018)
2. C.K. Leong, D.D.L. Chung, Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance. Carbon N. Y. 41(13), 2459–2469 (2003)
3. V. Sartre, M. Lallemand, Enhancement of thermal contact conductance for electronic systems. Appl. Therm. Eng. 21(2), 221–235 (2001)
4. C.K. Leong, D.D.L. Chung, Carbon black dispersions and carbon–silver combinations as thermal pastes that surpass commercial silver and ceramic pastes in providing high thermal contact conductance. Carbon 42(11), 2323–2327 (2004)
5. Y. Xu, X. Luo, D.D.L. Chung, Sodium silicate based thermal interface material for high thermal contact conductance sodium. Trans. ASME 122(June), 128–131 (2000)
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