1. Prediction of thermal contact resistance between polished surfaces;Wolff;Int J Heat Mass Transfer,1998
2. Thermal performance of heat transfer interface materials;Ouellette,1985
3. Thermal performance for a miniature heat sink cooled by microPCM slurry;Vogel,1995
4. Thermally conductive adhesives for highly thermally stressed assembly;Wilson,1996
5. Silicones with improved thermal conductivity for thermal management in electronic packaging;Peterson,1990