Funder
Fundamental Research Funds for the Central Universities
National Natural Science Foundation of China
Chinese Academy of Sciences
University of Science and Technology Beijing
Reference40 articles.
1. Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management;Franzon,2019
2. Recent Advances and Trends in Advanced Packaging
3. Enhanced thermal performance from liquid metal in copper/graphite filled elastomer
4. Integration of boron arsenide cooling substrates into gallium nitride devices
5. Proceedings of the 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing, Imaging, and Solar Energy, SPIE 8419;Liu,2012