Funder
Alfred P. Sloan Foundation
National Science Foundation
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials
Reference62 articles.
1. Waldrop, M. M. The chips are down for Moore’s law. Nature 530, 144–147 (2016).
2. Ball, P. Computer engineering: feeling the heat. Nature 492, 174–176 (2012).
3. ITRS. International Technology Roadmap for Semiconductors 2.0: Executive Report 79 (Semiconductor Industry Association, 2015).
4. Cui, Y., Li, M. & Hu, Y. Emerging interface materials for electronics thermal management: experiments, modeling and new opportunities. J. Mater. Chem. C 8, 10568 (2020).
5. Bubnova, O. Thermal release. Nat. Nanotechnol. 13, 620 (2018).
Cited by
67 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献