Advancing high thermal conductivity: novel theories, innovative materials, and applications in thermal management technologies

Abstract

Abstract Effective thermal management is crucial for the performance and stability of modern electronics, emphasizing the demand for high thermal conductivity ( κ ). This review summarizes the latest development in high κ , discussing the emerging theories, innovative materials and practical applications for interfacial heat dissipation. Unique phononic thermal transport behaviors are discussed, including four phonon–phonon scattering, hydrodynamic phonons, surface phonon-polaritons, and more. The review also highlights innovative materials with high κ , such as two-dimensional pentagonal structures, boron carbon nitrogen structures, hexagonal boron arsenide and θ-phase tantalum nitride. In addition, the potential of polymer composites reinforced with high κ fillers and surface engineering for advanced electronic applications are also discussed. By integrating these theoretical approaches and material innovations, this review offers comprehensive strategies for enhancing thermal management in modern electronic devices.