The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Published:2015-01 Issue: Volume:83 Page:357-371
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Zeng Guang,McDonald Stuart D.,Gu Qinfen,Terada Yasuko,Uesugi Kentaro,Yasuda Hideyuki,Nogita Kazuhiro

Funder

Japan Synchrotron Radiation Research Institute

SPring-8 synchrotron

Australian Synchrotron International Synchrotron Access Program

Australian Synchrotron Powder Diffraction Beamline

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference71 articles.

1. Recent advances on Sn–Cu solders with alloying elements: review;Zeng;J. Mater. Sci. Mater. Electron.,2011

2. Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys;Ventura;Acta Mater.,2011

3. Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys;Nogita;Scr. Mater.,2008

4. Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates;Nogita;JOM,2009

5. Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys;Nogita;Intermetallics,2010

Cited by 126 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints;Materials Characterization;2024-10

2. Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints;Materials Characterization;2024-09

3. Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints;Journal of Iron and Steel Research International;2024-08-12

4. Electronic and mechanical properties of η-Cu6Sn5 doped by Ni: A first-principles study;Materials Today Communications;2024-08

5. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging;Engineering Fracture Mechanics;2024-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3