Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys

Author:

Ventura Tina,Terzi Sofiane,Rappaz Michel,Dahle Arne K.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. .

2. Lead-free electronics;Bradley,2007

3. Nishimura T. In: International patent EP1043112; 1999.

4. Nishimura T, Suenaga S, Ikeda M. In: PRICM4; 2001.

5. Influence of thermal bouyancy on fibrous eutectic growth I. Segregation results in the Sn-Cu6Sn5 system

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