Effect of Mold Material and Solidification Conditions on Microstructural and Mechanical Properties of Directionally Solidified Sn-0.7Cu Alloy Developed Using Microwave Energy
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s11665-024-09732-9.pdf
Reference21 articles.
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2. X. Hu, Y. Li, Y. Liu, and Z. Min, Developments of High Strength Bi-Containing Sn0.7Cu Lead-Free Solder Alloys Prepared by Directional Solidification, J. Alloys Compd., 2015, 625, p 241–250. https://doi.org/10.1016/j.jallcom.2014.10.205
3. X. Hu, W. Chen, and B. Wu, Microstructure and Tensile Properties of Sn-1Cu Lead-Free Solder alloy Produced by Directional Solidification, Mater. Sci. Eng. A, 2012, 556, p 816–823. https://doi.org/10.1016/J.MSEA.2012.07.073
4. A.A. El-Daly and A.E. Hammad, Development of High Strength Sn-0.7Cu Solders with the Addition of Small Amount of Ag and in, J. Alloys Compd., 2011, 509(34), p 8554–8560. https://doi.org/10.1016/j.jallcom.2011.05.119
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