Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification-Reference-Cited by-同舟云学术

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Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Published:2015-03 Issue: Volume:625 Page:241-250
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Hu Xiaowu,Li Yulong,Liu Yi,Min Zhixian

Funder

Nature Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

1. Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders;El-Daly;Mater Des.,2014

2. Properties enhancement of SnAgCu solders containing rare earth Yb;Zhang;Mater Des.,2014

3. Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn-6.5Zn alloy;El-Daly;Mater Des.,2014

4. Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging;Hu;J. Alloys Comp.,2014

5. Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–07Cu solder alloy and copper substrate;Satyanarayan;J. Mater. Sci. Mater. Electron.,2012

Cited by 69 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Mold Material and Solidification Conditions on Microstructural and Mechanical Properties of Directionally Solidified Sn-0.7Cu Alloy Developed Using Microwave Energy;Journal of Materials Engineering and Performance;2024-06-21

2. Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification;Journal of Materials Research and Technology;2024-03

3. Zn additions modifying microstructure, thermal parameters and cytotoxicity of Sn-0.7Cu eutectic solder alloys;Materials Characterization;2023-11

4. Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers;Journal of Materials Science: Materials in Electronics;2023-09

5. The effect of permanent magnet stirring on the corrosion resistance of Sn-2.0Ag-0.5Cu-2Zn solder alloys in NaCl solution;Materials Chemistry and Physics;2023-07

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