Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification-Reference-Cited by-同舟云学术

Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification

Published:2024-03 Issue: Volume:29 Page:2585-2596
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Fan Jianglei^ORCID,Wang Jiaojiao,Wang Xiao,Liu Zhanyun,Wu Shen,Wang Yan,Li Ying,Zhou Xiangkui,Wei Shizhong

Funder

Foundation of Henan Educational Committee

Henan Province Natural Science Foundation

Publisher

Elsevier BV

Reference60 articles.

1. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging;Xin;Journal of Materials Science: Materials in Electronics,2022

2. Development of low temperature Cu-Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC);Hu;Microelectronics and Reliability,2021

3. Structure and properties of Sn-Cu lead-free solders in electronics packaging;Zhao;Science and Technology of Advanced Materials,2019

4. Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni;Mehreen;Journal of Alloys and Compounds,2018

5. Intense Pulsed Light soldering of Sn–3.0Ag–0.5Cu Ball Grid Array component on Au/Pd(P)/Ni(P) surface‐finished printed circuit board and its drop impact reliability;Ha;Advanced Engineering Materials,2023

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1. Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints;Journal of Materials Research and Technology;2024-07