Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification
Author:
Funder
Foundation of Henan Educational Committee
Henan Province Natural Science Foundation
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference60 articles.
1. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging;Xin;Journal of Materials Science: Materials in Electronics,2022
2. Development of low temperature Cu-Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC);Hu;Microelectronics and Reliability,2021
3. Structure and properties of Sn-Cu lead-free solders in electronics packaging;Zhao;Science and Technology of Advanced Materials,2019
4. Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni;Mehreen;Journal of Alloys and Compounds,2018
5. Intense Pulsed Light soldering of Sn–3.0Ag–0.5Cu Ball Grid Array component on Au/Pd(P)/Ni(P) surface‐finished printed circuit board and its drop impact reliability;Ha;Advanced Engineering Materials,2023
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