Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference35 articles.
1. Interfacial reactions between high-Pb solders and Ag
2. Mechanical properties of Pb-free SnAg solder joints
3. Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu
4. The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads
5. High temperature synthesis of Sn–3.5Ag–0.5Zn alloy nanoparticles by chemical reduction method
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