Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb; {(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys-Reference-Cited by-同舟云学术

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Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb; {(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys

Published:2023 Issue:04 Volume:14 Page:273-283
ISSN:2153-117X
Container-title:Materials Sciences and Applications
language:
Short-container-title:MSA

Author:

Uddin Shihab,Gafur Md. Abdul,Rahman Mohammad Obaidur

Publisher

Scientific Research Publishing, Inc.

Subject

General Engineering

Reference44 articles.

1. Effect of Sb addition on the tensile deformation behavior of lead-free Sn–3.5Ag solder alloy

2. Lead-free Solders in Microelectronics

3. Miyaki, M., Kanai, M. and Ogata, S. (1999) Soldering Properties for Lead-Free Solders of Sn-Ag-Cu System Solders. Proceedings of the Third IEMT/IMC Symposium (International Electronic Manufacturing Symposium and the International Microelectronics Conference), Omiya, 21-23 April 1999, 125-130.

4. Effect of Graphene Oxide Nano-Sheets (GONSs) on thermal, microstructure and stress–strain characteristics of Sn-5 wt% Sb-1 wt% Ag solder alloy

5. Control of compound forming reaction at the interface between SnZn solder and Cu substrate

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