Effect of Sb addition on the tensile deformation behavior of lead-free Sn–3.5Ag solder alloy
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference17 articles.
1. Lead-free solders in microelectronics;Abtew;Mater Sci Eng,2000
2. Room-temperature indentation creep of lead-free Sn–5%Sb solder alloy;Geranmayeh;J Electron Mater,2005
3. Effect of cooling rate on the room-temperature impression creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders;Mahmudi;Mater Sci Eng,2008
4. Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys;Mahmudi;Mater Des,2009
5. Properties of lead-free solder alloys with rare earth element additions;Wu;Mater Sci Eng,2004
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3. Sb Additions in Near-Eutectic Sn-Bi Solder Decrease Planar Slip;Journal of Electronic Materials;2023-08-24
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