Interfacial reactions between high-Pb solders and Ag
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference28 articles.
1. Lead-free Solders in Microelectronics
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects
4. Controlled Collapse Reflow Chip Joining
5. SLT Device Metallurgy and its Monolithic Extension
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2. Interfacial reactions between In and Ag during solid liquid interdiffusion process;Surfaces and Interfaces;2024-02
3. Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding;Materials Chemistry and Physics;2022-02
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