Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Cyclic stress–strain relationship of 63Sn37Pb solder under biaxial proportional and non-proportional loading;Chen;Mater. Des.,2007
2. Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy;Das;J. Alloys Comp.,2009
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1. Effect of Mold Material and Solidification Conditions on Microstructural and Mechanical Properties of Directionally Solidified Sn-0.7Cu Alloy Developed Using Microwave Energy;Journal of Materials Engineering and Performance;2024-06-21
2. Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification;Materials Today Communications;2024-03
3. Effects of In addition on microstructure and properties of SAC305 solder;Transactions of Nonferrous Metals Society of China;2023-11
4. Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations;Materials Science and Engineering: A;2022-10
5. Theoretical explorations of structure, mechanical properties, fracture toughness, electronic properties, and thermal conductivity of Ag-doped η′-Cu6Sn5;Intermetallics;2022-02
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