Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations-Reference-Cited by-同舟云学术

Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations

Published:2022-10 Issue: Volume:855 Page:143938
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Yang Ancang,Xiao Kunxuan,Duan Yonghua^ORCID,Li Caiju,Yi Jianhong,Peng Mingjun,Shen Li

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference71 articles.

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