Author:
Yang Ancang,Duan Yonghua,Li Caiju,Yi Jianhong,Peng Mingjun
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Cited by
15 articles.
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1. Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation;Materials Today Communications;2023-12
2. First‐Principles Study on Electronic and Elastic Properties of Co, Ni, Cu, and Mo‐Doped Β‐Si3N4;Advanced Theory and Simulations;2023-11-15
3. Tailoring the structure, mechanical, electronic, and thermodynamic properties of Al8Mn5 by doping Ti atom with different atomic site configurations;Journal of Materials Research and Technology;2023-09
4. Exploring the phase stability, mechanical and thermodynamic properties of FeCrAl ternary alloy;Journal of Materials Research and Technology;2023-09
5. The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases;Journal of Phase Equilibria and Diffusion;2023-06