Effect of temperature and alloying elements (Fe and Bi) on the electrical resistivity of Sn–0.7Cu solder alloy
Author:
Affiliation:
1. Department of Mechanical Engineering
2. Faculty of Engineering
3. University of Malaya
4. 50603 Kuala Lumpur
5. Malaysia
Abstract
The addition of Fe/Bi decrease the atomic percent of Sn4+, thus effect the electrical resistivity of the solder alloy.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2016/RA/C6RA08706J
Reference44 articles.
1. Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates
2. Characterization of low speed shear test reliability of Sn–1.0Ag–XCe/ENEPIG solder joint
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