Author:
Alam M.E.,Nai S.M.L.,Gupta M.
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference47 articles.
1. Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints
2. Lead-free Solders in Microelectronics
3. Microstructure and creep of eutectic indium/tin on copper and nickel substrates
4. Constitution of Binary Alloys;Hansen,1958
5. F. Hua, J. Glazer, in: R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Liaw, W.L. Winterbottom (Eds.), The Minerals, Metals and Materials Society (1997), pp. 65–74.
Cited by
42 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献