Microstructure evolution and shear behavior of Pb–16Sn–7.5Sb–xAg/Cu joints
Author:
Funder
National Science and Technology Project of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10853-024-09938-1.pdf
Reference46 articles.
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2. Brinlee S, Popelar S (2023) A physics-of-failure investigation of flip chip reliability based on lead-free solder fatigue modeling. J Microelectron Electron Packag 20:27–35. https://doi.org/10.4071/imaps.1939648
3. Jiang N, Zhang L, Liu Z-Q et al (2019) Reliability issues of lead-free solder joints in electronic devices. Sci Technol Adv Mater 20:876–901. https://doi.org/10.1080/14686996.2019.1640072
4. Wang S, Feng J, Wang S, Wang K, Yu M, Tian Y (2022) Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate. Mater Lett 325:132901. https://doi.org/10.1016/j.matlet.2022.132901
5. Sabbar EH, Al-Zubaidi HA, Aljumaili AK, Al-Jumaili MH, Al-Jumaili AI, Alsheakh H (2023) Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints. Microelectron Reliab 147:115103. https://doi.org/10.1016/j.microrel.2023.115103
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