Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference19 articles.
1. Electronics Without Lead
2. The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi
3. The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys
4. The Fourth Pacific Rim International Conference on Advanced Materials and Processing (PRICM4);Nishimura,2001
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