Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference18 articles.
1. Electronics Without Lead
2. Microstructure Control in Sn–0.7 mass%Cu Alloys
3. The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi
4. Phase diagrams of dilute binary alloys;Okamoto,2002
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