Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples-Reference-Cited by-同舟云学术

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Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Published:2008-06 Issue:1-2 Volume:485 Page:305-310
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Yang Ping-Feng,Lai Yi-Shao,Jian Sheng-Rui,Chen Jiunn,Chen Rong-Sheng

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference30 articles.

1. Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging;Yoon;J. Alloys Compd.,2005

2. Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition;Lai;Microelectron. Reliability,2006

3. Drop impact reliability testing for lead-free and lead-based soldered IC packages;Chong;Microelectron. Reliability,2006

4. Drop impact: fundamentals and impact characterisation of solder joints;Wong,2005

5. Transient fracturing of solder joints subjected to displacement-controlled impact loads;Yeh;Microelectron. Reliability,2006

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2. Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations;Intermetallics;2024-09

3. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps;Journal of Materials Research and Technology;2024-05

4. Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs;IEEE Transactions on Electron Devices;2024-03

5. Thermomechanical Properties of Zeta (Ag3In) Phase;Materials;2023-11-10

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