Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations

Author:

Liu Li,Zhang Chenru,Du Song,Chen Zhiwen,Li Simin,Chen Ziwen,Wang Qian,Xie Lingzhu,Liu Changqing

Publisher

Elsevier BV

Reference32 articles.

1. Lead-Free Soldering Process Development and Reliability;Zhang,2020

2. High-temperature Lead-free Solder Materials and Applications;Sabri,2019

3. Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology;Liu;J. Alloys Compd.,2019

4. Microstructure, electrochemical and mechanical properties of novel Zn-Sn-Cu-Ni high-temperature solder containing a small amount of Al;Chen;J. Mater. Sci. Mater. Electron.,2023

5. Characteristics of eutectic and near-eutectic Zn-Al alloys as high-temperature lead-free solders;Rahman;J. Mater. Sci. Mater. Electron.,2020

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