Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow
3. IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
4. Advances in lead-free electronics soldering
5. Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
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