Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)-Reference-Cited by-同舟云学术

Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)

Published:2005-12 Issue:12 Volume:45 Page:1916-1923
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chung Cho-Liang,Lu Liang-Tien,Lee Yao-Jung

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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2. Effects of reflow processing and flux residue on ionic migration of lead-free solder plating using the quartz crystal microbalance method;Tanaka;Mater Trans,2001

3. Microstructure investigation of Sn–0.5Cu–3.5Ag and Sn–3.5Ag–0.5Cu–0.5B lead-free solders;Ye;Solder Surf Mt Technol,2001

4. Interfacial microstructure of Pb–Sn solder balls in the ball–grid array package;Chi;J Electr Mater,2002

5. Lee NC, Bixenman M. Flux technology for lead-free alloys and its impact on cleaning. In: Electronic components and technology conference; 2002. 1484–90.

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2. Preparation of Environmental Protection and High Efficiency Lead-Free Solder Paste;Key Engineering Materials;2018-11

3. Lead-Free Soldering;Materials for Advanced Packaging;2009

4. Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints;Microelectronics Reliability;2008-03