Microstructure investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B lead‐free solders-Reference-Cited by-同舟云学术

Microstructure investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B lead‐free solders

Published:2001-12-01 Issue:3 Volume:13 Page:16-20
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:

Author:

Ye L.,Lai Z.H.,Liu J.,Thölén A.

Abstract

Identifies the intermetallics formed in Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B (wt%) lead‐free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were Ag3Sn and Cu6Sn5. Both solders were found to have a dispersion structure of Ag3Sn particles with network‐shaped subgrains. The microstructure of Ag3Sn was also found to become finer and more uniform in Sn‐3.5Ag‐0.5Cu‐0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu6Sn5 phase.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference12 articles.

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