Lead-Free Soldering-Reference-Cited by-同舟云学术

Lead-Free Soldering

Published:2009 Issue: Volume: Page:181-218
ISSN:
Container-title:Materials for Advanced Packaging
language:
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Author:

Lee Ning Cheng

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-0-387-78219-5_5.pdf

Reference100 articles.

1. IPC Global Solder Statistical Program Report for 2nd Quarter 2007, August 2007

2. “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by John H. Lau, C. P. Wong, Ning-Cheng Lee, S. W. Ricky Lee. Hardcover: 700 pages, 1st edition (August 27, 2002), by McGraw-Hill.

3. C. Hunt and D. Lea, “Solderability of Lead-Free Alloys”, in Proceedings of Apex 2000, Long Beach, CA, March 2000.

4. Nihon Superior data sheet, www.nihonsuperior.co.jp/english/products/leadfree/#01

5. Indium Corporation data sheet, www.indium.com/_dynamo/download.php?docid=500

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