1. Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson, Proc. 48th Electronic Component Technology Conf. (Seattle, WA, 25–28 May 1998), pp. 952–961.
2. A. Syed, Proc. Int. Symp. on Advanced Packaging Materials: Processes, Properties, and Interfaces (Braselton, GA, 11–14 March 2001), pp. 143–147.
3. A. Zribi, R.R. Chromik, R. Presthus, J. Clum, K. Teed, L. Zavalij, J. DeVita, J. Tova, and E.J. Cotts, 1999 ECTC (Tokyo, Japan, 1–3 February 1999), pp. 451–457.
4. K. Suganuma, IPC Works: Get the Lead Out Symp. (1999).
5. E. Bradley and J. Hranisavljevic, 2000 ECTC (Las Vegas, NV, 21–24 May 2000), pp. 1443–1448.