Affiliation:
1. Hubei University of Technology
Abstract
The components of the flux are optimized and the environmental friendly flux withexcellent comprehensive performance is prepared. Then the composition of the solder paste isoptimized to prepare the SMT environmental protection and high efficient lead-free solder paste, andits performance is studied. The results show that the storage stability, printability, weldability andenvironmental protection of the SMT environmental protection and high efficient lead-free solderpaste are good, and the reliability is high. The related technical indexes have reached or superior tothe commercial solder paste, and have reached the commercial level initially.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference8 articles.
1. W. D. Zhang, Practical surface assembly technology, Beijing: Electronic Industry Press, (2015).
2. Z. Z. Jia, Analysis and case analysis of SMT core process, Beijing: Electronic Industry Press, (2016).
3. G. S. Gan, C. H. Du, C. T. Li, Design of lead-free solders and pollution control of lead, Adv. Mater. Res. 881-883 (2014) 1435-1438.
4. C. L. Chung, L. T. Lu, Y. J. Lee, Influence of halogen-free compound and lead-free solder paste on on-board reliability of green chip scale package, Microelectr. Reliab. 45(12) (2005) 1916-(1923).
5. H. Wack, J. Becht, Cleaning No-clean Solder and Flux, Surf. Mount Tech. 2(6) (2010) 62-65.
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1 articles.
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