Design of Lead-Free Solders and Pollution Control of Lead
Author:
Affiliation:
1. 1School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China
2. Chongqing University of Technology
Abstract
Publisher
Trans Tech Publications, Ltd.
Subject
General Engineering
Link
https://www.scientific.net/AMR.881-883.1435.pdf
Reference11 articles.
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3. B.T. Zhou, T.R. Bieler, G.L. Wu, S. Zaefferer, T.K. Lee, K.C. Liu. Journal of Electronic Materials Vol. 41(2012), p.262.
4. I.E. Anderson, A. Boesenberg, J. Harringa, D. Riegner, A. Steinmetz, D. Hillman. Journal of Electronic Materials Vol. 41(2012) , p.390.
5. Y.H. Tian, W. Liu, An @bullet, W. Zhang, L. Niu,C. Q Wang. Journal of Materials Science: Materials in Electronics Vol. 23(2012) , p.136.
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