Formation Enthalpy, Free-Energy and Activity Coefficients of Sn-Pb Eutectic Solders

Author:

Gan Gui Sheng1,Chen Fang2,Zeng Rong Chang2,Du Yun Fei2,Du Chang Hua2

Affiliation:

1. University of Science and Technology Beijing

2. Chongqing Institute of Technology

Abstract

Based on Miedema’s model, the enthalpy of formation, excess free-energy and partial molar excess free-energy of Sn-Pb binary alloy solders were calculated. The model of the activity coefficient for each component in the solders was established. The diagrams of enthalpy of formation, free energy versus composition and activity versus composition and temperature as well as activity coefficients as a function of composition and/or temperature were drawn. And then the relationship between the activity coefficients of elements Sn/Pb in the solders and temperature was obtained. The approaches to reduction in the volatilization of lead at high temperature were proposed from the point of views that the lead pollution to environment results from its chemical activity in the solder alloys.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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