Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis
Author:
Funder
České Vysoké Učení Technické v Praze
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s40194-024-01824-3.pdf
Reference35 articles.
1. Yunus M, Primavera A, Srihari K, Pitarresi JM (2000) Effect of voids on the reliability of BGA/CSP solder joints. In: Twenty Sixth IEEECPMT Int Electron Manuf Technol Symp Cat No00CH37146, IEEE, Santa Clara, CA, USA, pp 207–213. https://doi.org/10.1109/IEMT.2000.910730
2. Easton J, Struk P, Rotella A (2008) Imaging and analysis of void-defects in solder joints formed in reduced gravity using high-resolution computed tomography. In: 46th AIAA Aerosp Sci Meet Exhib, American Institute of Aeronautics and Astronautics, Reno, Nevada, 2008. https://doi.org/10.2514/6.2008-824
3. Steiner F, Wirth V, Hirman M (2019) Relationship of soldering profile, voids formation and strength of soldered joints. In: 2019 42nd Int Spring Semin Electron Technol ISSE, IEEE, Wroclaw, Poland, pp 1–6. https://doi.org/10.1109/ISSE.2019.8810303
4. Zhu N (1999) Thermal impact of solder voids in the electronic packaging of power devices. In: Fifteenth Annu IEEE Semicond Therm Meas Manag Symp Cat No99CH36306, IEEE, San Diego, CA, USA, pp 22–29. https://doi.org/10.1109/STHERM.1999.762424
5. Aspandiar R (2018) Voids in Solder Joints, SMTA Boise Expo Tech Forum
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