Study of die attach technologies for high temperature power electronics: Silver sintering and gold

Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

Published:2013-09 Issue:9-11 Volume:53 Page:1617-1621
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Sabbah Wissam,Azzopardi Stéphane,Buttay Cyril,Meuret Régis,Woirgard Eric

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Die attach materials for high temperature applications: a review components;Manikam;IEEE Trans Pack Manuf Technol,2011

2. Gobi C et al. Low temperature sinter technology Die attachment for automotive power electronic applications, automotive power electronics. In: Proceedings of the 6th international conference on integrated power electronics systems (CIPS); 2006. p. 1–5.

3. Low-temperature sintering of nanoscale silver paste for attaching large-area (>100mm2) chips;Lei;IEEE Trans Compon Pack Technol,2010

4. Buttay C et al. Die attach of power devices using silver sintering – bonding process optimisation and characterization. In: Proceedings of the European conference on power electronics (EPE 11); 2011.

5. A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization;Le Henaff;Microelectron Reliab,2012

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