Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips-Reference-Cited by-同舟云学术

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Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

Published:2010-03 Issue:1 Volume:33 Page:98-104
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Lei Thomas Guangyin,Calata Jesus Noel,Lu Guo-Quan,Chen Xu,Luo Shufang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/5429141/05352309.pdf?arnumber=5352309

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