Review of Die-Attach Materials for SiC High-Temperature Packaging-Reference-Cited by-同舟云学术

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Review of Die-Attach Materials for SiC High-Temperature Packaging

Published:2024-10 Issue:10 Volume:39 Page:13471-13486
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Hou Fengze¹^ORCID,Sun Zhanxing¹,Su Meiying¹^ORCID,Fan Jiajie²,You Xiangan¹,Li Jun¹^ORCID,Wang Qidong¹^ORCID,Cao Liqiang¹^ORCID,Zhang Guoqi³^ORCID

Affiliation:

1. Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China

2. Institute of Future Lighting, Academy for Engineering and Technology, Fudan University, Shanghai, China

3. Department of Microelectronics Engineering, Delft University of Technology, Delft, The Netherlands

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/63/10659247/10568422.pdf?arnumber=10568422

Reference118 articles.

1. Review of Packaging Schemes for Power Module

2. A Survey of Wide Bandgap Power Semiconductor Devices

3. Innovative and Reliable Power Modules: A Future Trend and Evolution of Technologies

4. Macro- and Micro-Deformation Behavior of Sintered-Copper Die-Attach Material

5. Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

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