A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization-Reference-Cited by-同舟云学术

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

Published:2012-09 Issue:9-10 Volume:52 Page:2321-2325
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Le Henaff F.,Azzopardi S.,Deletage J.Y.,Woirgard E.,Bontemps S.,Joguet J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Die attach materials for high temperature applications: a review components;Manikam;IEEE Trans Pack Manuf Technol,2011

2. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications;Li;Mater Sci Eng,2006

3. Guth K et al. New assembly and interconnects beyond sintering methods. In: Proceedings of PCIM; 2010. p. 232–37

4. Low temperature sinter technology die attachment for automotive power electronic applications;Göbl;Automot Power Electron,2006

5. Wissam W et al. Evaluation of silver-sintering die attach. In: CIPS 2012. Nuremberg, 6–8 March 2012.

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