The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis-Reference-Cited by-同舟云学术

The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis

Published:2023-06 Issue:6 Volume:13 Page:816-822
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Qu Guanda¹,Deng Zhongyang²^ORCID,Guo Wei¹,Peng Zilong¹,Jia Qiang³,Deng Erping⁴^ORCID,Zhang Hongqiang¹^ORCID

Affiliation:

1. School of Mechanical Engineering and Automation, Beihang University, Beijing, China

2. Department of Mechanical Engineering, Tsinghua University, Beijing, China

3. Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China

4. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing, China

Funder

National Natural Science Foundation of China

State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference39 articles.

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