Heat Dissipation Enhancement of High-Power Deep-Ultraviolet LEDs Through Plated Copper on Thick Film Diamond Substrates

Author:

Ding Yongjie1,Xu Linlin2,Wang Qing3ORCID,Liang Renli4ORCID,Peng Yang5ORCID,Wang Xinzhong4,Dai Jiangnan2,Chen Mingxiang1ORCID

Affiliation:

1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

2. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, China

3. School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China

4. Information Technology Research Institute, Shenzhen Institute of Information Technology, Shenzhen, China

5. School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan, China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Fund

Program of Wuhan Donghu New Technology Development Zone

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

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