Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization

Author:

Buttay Cyril1,Masson Amandine1,Li Jianfeng2,Johnson Mark2,Lazar Mihai1,Raynaud Christophe1,Morel Hervé1

Affiliation:

1. 1Université de Lyon, F-69621, France, CNRS, UMR5005, France, INSA Lyon, Université Claude Bernard Lyon 1, Laboratoire Ampère, bâtiment L. de Vinci, 21 avenue Capelle, F-69621, France

2. 2Faculty of Engineering, University of Nottingham, University Park, Nottingham, NG7 2RD, United Kingdom

Abstract

Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

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